hlmp-ns31 and hlmp-nm31 t- (3mm) ingan led lamps data sheet description these ingan lamps are designed in industry standard package with clear and non-difused optics. these lamps are ideal for use as indicator and for general purpose lighting. package dimensions features ? general purpose led ? reliable and rugged ? binned for color and intensity ? bright ingan dice applications ? status indicator ? small message panel ? running and decorative lights for commercial use ? back lighting ? consumer audio caution: devi c es are c lass 1 es d sensitive. please observe a pp ro p riate p re c autions d uring han d ling an d p ro c essing. r efer to a pp li c ation n ote an -1142 for a dd itional d etails notes: 1. all dimensions are in millimeters (inches). 2. epoxy meniscus may extend about 1 mm (0.040) down the leads. 23.0 min. 5.85 0.50 2.54 0.30 4.40 0.30 3.10 0.20 3.50 0.30 1.0 min. 2.00 3.40 0.20 0.44 0.20 0.40 + 0.10 - 0 cathode marks 0.45 + 0.10 - 0.04 0.65 max.
selection guide part number color and dominant wavelength d (nm) typ. luminous intensity, iv (mcd) at 20 ma viewing angle, 2? (degree) tinting type min. typ. hlmp-ns3 -j00xx blue 470 40 600 30 un-tinted; non-difused hlmp-nm3 -r00xx green 5 9 500 800 notes: 1. the luminous intensity is measured on the mechanical axis of the lamp package 2. the tolerance for intensity limit is 15% 3. the optical axis is closely aligned with the package mechanical axis 4. the dominant wavelength, l d, is derived from the chromaticity diagram and represents the color of the lamp. absolute maximum ratings, t a =25c parameter blue /green unit dc forward current [] 30 ma peak forward current 00 ma reverse voltage (i r = 0a) 5 v led junction temperature 5 c operating temperature range -40 to +85 c storage temperature range -40 to +85 c notes: 1. derate linearly as shown in figure 5 electrical/optical characteristics parameter symbol min. typ. max. units test condition forward voltage v f 3.0 3.3 4.0 v i f = 0 ma reverse voltage v r 5 v i r = 0 a dominant wavelength d ns3 nm3 460 50 470 59 480 540 nm i f = 0 ma peak wavelength peak ns3 nm3 464 59 nm peak of wavelength of spectral distribution at i f = 0 ma thermal resistance r j-pin 90 c/w notes: 1. the dominant wavelength d is derived from the chromaticity diagram and represents the color of the lamp. 2. tolerance for each color bin limit is 0.5 nm
3 figure 1. relative intensity vs wavelength for hlmp-ns31 figure 2. relative intensity vs wavelength for hlmp-nm31 figure 3. forward current vs forward voltage figure 4. relative intensity vs forward current figure 5. maximum forward current vs ambient temperature based on tj=110c figure 6. radiation pattern 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 400 450 500 550 600 650 wavelength - nm relative intensity 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 380 430 480 530 580 wavelength - nm relative intensity 0 5 10 15 20 25 30 0 1 2 3 4 forward voltage - v forward current - ma 0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 0 5 10 15 20 25 30 35 dc forward current - ma relative luminous intensity (normalized at 20 ma) 0 10 20 30 40 0 2 0 4 0 6 0 8 0 100 vf - forward voltage - volts if - forward current - ma rj-a=780c/w 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1 -90 -60 -30 0 3 0 6 0 9 0 angular displacement - degrees normalized intensity
4 intensity bin limit table bin intensity (mcd) at 20 ma min max j 40 30 k 30 400 l 400 50 m 50 680 n 680 880 p 880 50 q 50 500 r 500 900 s 900 500 t 500 300 u 300 400 tolerance for each bin limit is 15% blue color bin limit table bin intensity (mcd) at 20 ma min max 460 464 464 468 3 468 47 4 47 476 5 476 480 tolerance for each bin limit is 0.5nm green color bin limit table bin dominant wavelength (nm) at 20 ma min max 50 54 54 58 3 58 53 4 53 536 5 536 540 tolerance for each bin limit is 0.5nm
5 precautions: lead forming: ? the leads of an led lamp may be preformed or cut to length prior to insertion and soldering into pc board. ? if lead forming is required before soldering, care must be taken to avoid any excessive mechanical stress induced to led package. otherwise, cut the leads of led to length after soldering process at room temperature. the solder joint formed will absorb the mechanical stress of the lead cutting from traveling to the led chip die attached and wirebond. ? it is recommended that tooling made to precisely form and cut the leads to length rather than rely upon hand operation. soldering condition: ? care must be taken during pcb assembly and soldering process to prevent damage to led component. ? the closest led is allowed to solder on board is 1.59mm below the body (encapsulant epoxy) for those parts without standofs. ? recommended soldering condition: wave soldering manual solder dipping pre-heat temperature 05 oc max. - pre-heat time 30 sec max. - peak temperature 50 oc max. 60 oc max. dwell time 3 sec max. 5 sec max. ? wave soldering parameter must be set and maintain according to recommended temperature and dwell time in the solder wave. customer is advised to periodically check on the soldering profle to ensure the soldering profle used is always conforming to recommended soldering condition. ? if necessary, use fxture to hold the led component in proper orientation with respect to the pcb during soldering process. ? proper handling is imperative to avoid excessive thermal stresses to led components when heated. therefore, the soldered pcb must be allowed to cool to room temperature, 25 oc before handling. ? special attention must be given to board fabrication, solder masking, surface plating and lead holes size and component orientation to assure solderability. ? recommended pc board plated through hole size for led component leads: led component lead size diagonal plated through hole diameter 0.457 x 0.457 mm (0.08 x 0.08 inch) 0.646 mm (0.05 inch) 0.976 to .078 mm (0.038 to 0.04 inch) 0.508 x 0.508 mm (0.00 x 0.00 inch) 0.78 mm (0.08 inch) .049 to .50 mm (0.04 to 0.045 inch) note: refer to application note an1027 for more information on soldering led components. bo tt om side of pc bo ard to p side of pc bo ard no te: allow for bo ards to be sufficientl y cooled before exerting mechanical force. convey or speed = 1.83 m/min (6 ft/mi n prehea t setting = 150 c (100 c pcb) solder wa ve tempera ture = 245 c air knife air tempera ture = 390 c air knife dist ance = 1.91 mm (0.25 in.) air knife angle = 40 solder: sn63; flux: rma 250 200 150 fluxing turb ulent wa ve prehea t time - seconds temperature - c 100 50 30 0 1 0 2 0 3 04 0 5 0 6 07 0 8 09 0 1 00 laminar wa ve ho t air knife
for product information and a complete list of distributors, please go to our web site: www.avagotech.com avago, avago technologies, and the a logo are trademarks of avago technologies, limited in the united states and other countries. data subject to change. copyright ? 007 avago technologies limited. all rights reserved. av0 -0044en - january 5, 007
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